1. 2. 3. material content data sheet sales product name TDA5200 issued 7. september 2015 ma# ma000226440 package pg-tssop-28-1 weight* 106.95 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.077 1.94 1.94 19418 19418 leadframe non noble metal nickel 7440-02-0 14.398 13.46 134620 non noble metal iron 7439-89-6 19.882 18.59 32.05 185904 320524 wire noble metal gold 7440-57-5 0.984 0.92 0.92 9197 9197 encapsulation organic material carbon black 1333-86-4 0.197 0.18 1844 plastics epoxy resin - 8.348 7.81 78051 inorganic material silicondioxide 60676-86-0 57.184 53.47 61.46 534684 614579 leadfinish non noble metal tin 7440-31-5 1.559 1.46 1.46 14574 14574 plating noble metal silver 7440-22-4 1.416 1.32 1.32 13237 13237 glue plastics acrylic resin - 0.181 0.17 1694 noble metal silver 7440-22-4 0.725 0.68 0.85 6777 8471 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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